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dc.contributor.authorGuo, Y. X.en
dc.contributor.authorWai, L. L.en
dc.contributor.authorSun, Meien
dc.contributor.authorZhang, Yue Pingen
dc.contributor.authorChua, Kai Mengen
dc.identifier.citationSun, M., Zhang, Y. P., Guo, Y. X., Chua, K. M., & Wai, L. L. (2009). Integration of grid array antenna in chip package for highly integrated 60-GHz radios. IEEE Antennas And Wireless Propagation Letters, 8, 1364-1366.en
dc.description.abstractA grid array antenna integrated in a thin cavity-down ceramic ball grid array (CBGA) package in low-temperature cofired ceramic (LTCC) technology is reported. The grid array antenna, intended for use in highly integrated 60-GHz radios, has achieved good matching (|S11| ¿ -10 dB) and directional patterns from 57 to 64 GHz as well as high gain with the peak value of 13.5 dBi at 60 GHz.en
dc.format.extent3 p.en
dc.relation.ispartofseriesIEEE antennas and wireless propagation lettersen
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dc.subjectDRNTU::Engineering::Electrical and electronic engineeringen
dc.titleIntegration of grid array antenna in chip package for highly integrated 60-GHz radiosen
dc.typeJournal Articleen
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen
dc.description.versionPublished versionen
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