Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/91728
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dc.contributor.authorNai, S. M. L.en
dc.contributor.authorXu, L. Y.en
dc.contributor.authorHan, Yongdianen
dc.contributor.authorJing, Hongyangen
dc.contributor.authorTan, Cher Mingen
dc.contributor.authorWei, Junen
dc.date.accessioned2010-06-04T08:23:07Zen
dc.date.accessioned2019-12-06T18:10:56Z-
dc.date.available2010-06-04T08:23:07Zen
dc.date.available2019-12-06T18:10:56Z-
dc.date.copyright2009en
dc.date.issued2009en
dc.identifier.citationHan, Y., Jing, H., Nai, S. M. L., Xu, L. Y., Tan, C. M., & Wei, J. (2009). Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth. Electronics Packaging Technology Conference, pp.292-295.en
dc.identifier.urihttps://hdl.handle.net/10356/91728-
dc.description.abstractIn the present study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix, to form a composite solder. The interfacial intermetallic compound layer thickness formed on electroless nickel immersion gold (ENIG) metallized Cu substrate was determined under the assoldered condition. It was observed that the addition of 0.01 wt.% Ni-CNTs into the Sn-Ag-Cu solder matrix, affected the formation of intermetallic compounds during the soldering reaction. For the reaction between the composite solder and the ENIG/Cu substrate, (Cu1-xNix)6Sn5 and (Cu1-yNiy)3Sn4 were formed. The test results revealed that the thickness of interfacial IMC decreased from 2.30 μm to 1.84 μm with the addition of Ni-CNTs. Shear tests were also conducted on the as-soldered solder joints. The shear test results revealed that the composite solder joint exhibited a ~ 15% increase in yield strength and a ~ 17% increase in ultimate shear strength, as compared to its monolithic counterpart.en
dc.format.extent4 p.en
dc.language.isoenen
dc.rights© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en
dc.subjectDRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnectsen
dc.titleEffect of Ni-coated carbon nanotubes on interfacial intermetallic layer growthen
dc.typeConference Paperen
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen
dc.contributor.conferenceElectronics Packaging Technology Conference (11th : 2009 : Singapore)en
dc.identifier.doi10.1109/EPTC.2009.5416534en
dc.description.versionPublished versionen
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