Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/93083
Title: Complex shaped on-wafer interconnects modeling for CMOS RFICs
Authors: Shi, Xiaomeng
Yeo, Kiat Seng
Ma, Jianguo
Do, Manh Anh
Li, Erping
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2008
Source: Shi, X., Yeo, K. S., Ma, J. G., Do, M. A., & Li, E. (2008). Complex Shaped On-Wafer Interconnects Modeling for CMOS RFICs. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 16(7), 922-926.
Series/Report no.: IEEE transactions on very large scale integration (VLSI) systems
Abstract: A model development methodology for complex shaped on-wafer interconnects is presented. The equivalent circuit of the entire interconnect is obtained by cascading basic subsegment models. The extracted parameters are formulated into empirical expressions. Thus, the proposed model can be easily incorporated with commercial electronic design automation (EDA) tools. The accuracy of the model is validated by the on-wafer measurements up to 20 GHz.
URI: https://hdl.handle.net/10356/93083
http://hdl.handle.net/10220/6252
ISSN: 1063-8210
DOI: 10.1109/TVLSI.2008.2000445
Rights: © 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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