Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/93934
Title: A hypersingular boundary integral analysis of axisymmetric steady-state heat conduction across a non-ideal interface between two dissimilar materials
Authors: Chen, E. L.
Ang, Whye Teong
Fan, Hui
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2011
Source: Chen, E. L., Ang, W. T., & Fan, H. (2011). A hypersingular boundary integral analysis of axisymmetric steady-state heat conduction across a non-ideal interface between two dissimilar materials. Engineering Analysis with Boundary Elements, 35.
Series/Report no.: Engineering analysis with boundary elements
Abstract: Steady-state axisymmetric heat conduction across a non-ideal interface between two dissimilar materials is considered. The non-ideal interface may be either low or high conducting. The relevant interfacial conditions are formulated in terms of hypersingular boundary integral equations. A simple boundary element procedure based on the hypersingular boundary integral formulations is proposed for solving numerically the axisymetric heat conduction problem under consideration. Numerical results for some specific problems are obtained.
URI: https://hdl.handle.net/10356/93934
http://hdl.handle.net/10220/7164
DOI: 10.1016/j.enganabound.2011.05.001
Rights: © 2011 Elsevier. This is the author created version of a work that has been peer reviewed and accepted for publication by Engineering Analysis with Boundary Elements, Elsevier. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [DOI: http://dx.doi.org/10.1016/j.enganabound.2011.05.001].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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