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dc.contributor.authorNguyen, Nam-Trungen_US
dc.contributor.authorWong, Teck Nengen_US
dc.contributor.authorChai, John Chee Kiongen_US
dc.contributor.authorYobas, Leventen_US
dc.contributor.authorTing, Teck-Huien_US
dc.contributor.authorYap, Yit Fatten_US
dc.identifier.citationTing, T. H., Yap, Y. F., Nguyen, N. T., Wong, T. N., Chai, J. C. K., & Yobas. L. (2006). Thermally mediated breakup of drops in microchannels. Applied Physics Letters, 89(23).en_US
dc.description.abstractThe authors used thermally induced surface tension gradients to manipulate aqueous droplets in microchannels. Control of the droplet breakup process was demonstrated. Droplet sorting can be achieved with temperatures above a critical value. Numerical simulation using a two-dimensional model agrees qualitatively well with the experimental results. The used control temperature of less than 55 °C shows that this active control concept is suitable for biochemical applications. Thermal control promises to be a simple and effective manipulation method for droplet-based lab on a chip.en_US
dc.format.extent4 p.en
dc.relation.ispartofApplied Physics Lettersen_US
dc.relation.ispartofseriesApplied physics lettersen
dc.rights© 2006 American Institute of Physics. This paper was published in Applied Physics Letters and is made available as an electronic reprint (preprint) with permission of American Institute of Physics. The paper can be found at DOI: [].  One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.en_US
dc.subjectDRNTU::Engineering::Mechanical engineeringen_US
dc.titleThermally mediated breakup of drops in microchannelsen_US
dc.typeJournal Articleen
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.versionPublished versionen_US
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