Buckling and cracking of thin films on compliant substrates under compression

Abstract

It is shown that unless the substrate is at least as stiff as the film, the energy stored in the substrate contributes significantly to the energy release rate of film delamination under compression either with or without cracking. For very compliant substrates, such as polyethylene terephthalate (PET) with a indium tin oxide (ITO) film, the energy release rate allowing for the deformation of the substrate can be more than an order of magnitude greater than the value obtained neglecting the substrate's deformation. The argument that buckling delaminations tunnel at the tip rather than spread sideways because of increase in mode-mixity may need modification; it is still true for stiff substrates, but for compliant substrates the average energy release rate decreases with delamination width and the limitation in buckled width may be due to this stability as much as the increase in mode-mixity.