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dc.contributor.authorXu, Huien
dc.contributor.authorLiu, Changqingen
dc.contributor.authorSilberschmidt, Vadim V.en
dc.contributor.authorPramana, S. S.en
dc.contributor.authorWhite, Timothy Johnen
dc.contributor.authorChen, Z.en
dc.identifier.citationXu, H., Liu, C., Silberschmidt, V. V.,Pramana, S. S., White, T. J., & Chen, Z. (2009). A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads. Scripta Materialia, 61(2), 165-168.en
dc.description.abstractThe nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm thick). Where oxides persisted, an amorphous aluminium oxide layer connected with a crystalline copper oxide. It was estimated that ultrasonic vibration caused an effective local temperature increase to 465 °C that accelerated interdiffusion and enhanced the formation of Cu–Al intermetallics.en
dc.relation.ispartofseriesScripta materialiaen
dc.rights© 2009 Acta Materialia Inc. This is the author created version of a work that has been peer reviewed and accepted for publication in Scripta Materialia, published by Elsevier on behalf of Acta Materialia Inc.  It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document.  The published version is available at: [].en
dc.titleA re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization padsen
dc.typeJournal Articleen
dc.contributor.schoolSchool of Materials Science & Engineeringen
dc.description.versionAccepted versionen
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