Please use this identifier to cite or link to this item:
Title: Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints
Authors: Nai, S. M. L.
Xu, L. Y.
Wei, J.
Jing, Hongyang
Tan, Cher Ming
Han, Yongdian
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2012
Source: Han, Y., Jing, H., Nai, S. M. L., Xu, L. Y., Tan, C. M., & Wei, J. (2012). Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints. Journal of electronic materials, 41(9), 2478-2486.
Series/Report no.: Journal of electronic materials
Abstract: In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn-Ag-Cu (SAC) solder matrix, to form composite solder. Up to 0.05% of Ni-CNTs were successfully incorporated. The interfacial microstructure and shear strength of solders on Ni/Au-finished Cu substrates were investigated after aging at 150°C for up to 42 days. Results revealed that, after soldering and aging for various lengths of time, the interfacial intermetallic compound (IMC) thickness of the unreinforced solder joint was observed to grow more significantly than that of the composite solder joints. Furthermore, the composite solder joints also showed lower diffusion coefficients (2.5 × 10−15 cm2/s to 3.2 × 10−15 cm2/s) compared with that of the SAC solder joints (4.9 × 10−15 cm2/s). Shear test results revealed that as-soldered and aged composite solder joints had better ultimate shear strength than their monolithic counterparts and the shear strength of all aged solder joints decreased with increasing aging time.
DOI: 10.1007/s11664-012-2142-2
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Journal Articles


Updated on Jun 18, 2020


Updated on Jan 17, 2021

Page view(s)

Updated on Jan 22, 2021

Google ScholarTM




Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.