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Title: Effect of oxygen concentration on the thermal stability of magnetron sputtered amorphous Ta–Ni thin films
Authors: Yan, Hua
Santoso, Raissa Nathania
Jiang, Yueyue
Liang, Meng Heng
Chen, Zhong
Issue Date: 2011
Source: Yan, H., Santoso, R. N., Jiang, Y., Liang, M. H., & Chen, Z. (2012). Effect of oxygen concentration on the thermal stability of magnetron sputtered amorphous Ta–Ni thin films. Thin Solid Films, 520(6), 2356-2361.
Series/Report no.: Thin solid films
Abstract: The effect of oxygen concentration on the thermal stability of amorphous Ta–Ni thin film alloy is studied in this work. The films were deposited on Si substrates by co-sputtering of Ta and Ni targets. The oxygen concentration in the Ta–Ni films was controlled by applying radio frequency (RF) substrate bias ranging from 0 W to 100 W. Ta–Ni Films with oxygen concentration from 0.95 to 5.25 at.% were obtained, with lower oxygen concentration obtained at higher RF bias. At the as-deposited state, all the Ta–Ni films are amorphous. Increase of oxygen concentration leads to increased electrical resistivity. The as-deposited amorphous films possess different thermal stability after annealing in vacuum for 30 min at temperatures ranging from 700 °C to 800 °C. Formation of TaSi2 starts at 750 °C in films formed with lower oxygen concentration (0.95 at.%), while Ta2O5 and Ta-based phases are observed in films formed with higher oxygen concentration (4.89 at.% and 5.25 at.%). Our work shows that change of oxygen concentration affects the electrical conductivity and thermal stability of the Ta–Ni films. The presence of varying amount of oxygen also changes the Ta–Ni crystallization behavior as well as the interface stability of the Ta–Ni/Si film on silicon substrate.
ISSN: 0040-6090
DOI: 10.1016/j.tsf.2011.11.002
Rights: © 2011 Elsevier B.V.
Fulltext Permission: none
Fulltext Availability: No Fulltext
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