Thermal-mechanical design of sandwich SiC power module with micro-channel cooling

Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/96479

Title:	Thermal-mechanical design of sandwich SiC power module with micro-channel cooling
Authors:	Yin, Shan Tseng, King Jet Zhao, Jiyun
Keywords:	DRNTU::Engineering::Electrical and electronic engineering
Issue Date:	2013
Source:	Yin, S., Tseng, K. J., & Zhao, J. (2013). Thermal-mechanical design of sandwich SiC power module with micro-channel cooling. 2013 IEEE 10th International Conference on Power Electronics and Drive Systems (PEDS), 535-540.
Abstract:	A sandwich packaging structure of SiC power module for HEV application has been designed and numerically investigated by CFD study. The design has a micro-channel heat sink integrated in the back Cu-layer of DBC substrate. Doubleside cooling is adopted and liquid coolant (ethylene glycol, 105 °C) flows in opposite directions in the two heat sinks. Compared with wirebonding packaging, the proposed sandwich structure can almost double the cooling efficiency (thermal resistance 0.11 K/W) and temperature-distribution uniformity. Finite element analysis of thermal stress was further carried out to check that the CTE mismatch in the packaging has been minimized.
URI:	https://hdl.handle.net/10356/96479 http://hdl.handle.net/10220/17272
DOI:	10.1109/PEDS.2013.6527077
Fulltext Permission:	none
Fulltext Availability:	No Fulltext
Appears in Collections:	EEE Conference Papers

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