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dc.contributor.authorAnnamdas Venu Gopal Madhaven
dc.contributor.authorYang, Yaowenen
dc.contributor.authorPark, Seungheeen
dc.identifier.citationAnnamdas, V. G. M., Yang, Y., & Park, S. (2012). Application of Three Dimensional Electromechanical Impedance Model for Damage Assessment of Plate. Proceedings of SPIE - The International Society for Optical Engineering, 8345.en
dc.description.abstractCost-effective and reliable damage detection models are crucial for successful monitoring of any ancient or modern age engineering structure. Lead Zirconate Titanate (PZT) based electromechanical impedance (EMI) method is emerging as a promising alternate for conventional structural health monitoring (SHM) of various engineering structures. The PZT patches are usually surface bonded and then excited in the presence of electric field to a desired frequency spectrum. The excitations result in prediction of unique frequency dependent electromechanical (EM) admittance signature. Any change in the signature during the monitoring period indicates dis-integrity/ damage in the host structure. However, apart from locating damages, the increase in severity of damages has to be predicted on time to avoid collapse of the entire structure. This paper presents such a model which had effectively predicted the severity of damages along a principle direction of the structure. This was achieved by experimental damage study on plates and subsequent verification by semi numerical 3D model. Statistical root mean square deviation (RMSD) index was used for evaluating the damages made on plates. Additionally, a new frequency proximity index (FPI) was introduced to measure the effectiveness of the model. RMSD measures the changes in height of peaks of signature and FPI scales the frequency spectrum of signature. Thus results of RMSD index and FPI are used as complementary to each other to study damage propagation in a structure.en
dc.relation.ispartofseriesProceedings of SPIE - The international society for optical engineeringen
dc.rights© 2012 Society of Photo-Optical Instrumentation Engineers (SPIE). This paper was published in Proceedings of SPIE - The International Society for Optical Engineering and is made available as an electronic reprint (preprint) with permission of Society of Photo-Optical Instrumentation Engineers (SPIE). The paper can be found at the following official DOI: [].  One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.en
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Microelectromechanical systemsen
dc.titleApplication of three dimensional electromechanical impedance model for damage assessment of plateen
dc.typeConference Paperen
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen
dc.contributor.conferenceSmart Structures and Materials + Nondestructive Evaluation and Health Monitoring (2012 : San Diego, USA)en
dc.description.versionPublished versionen
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