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Title: Study of metal additives to alumina ceramics substrate for high temperature and pressure application
Authors: Made, Riko I.
Phua, Eric Jian Rong
Sharif, Ahmed
Pramana, Stevin Snellius
Wong, Chee Cheong
Chen, Zhong
Nachiappan, Vivek Chidambaram
Ho, Beng Yeung
Gao, Shan
Tok, Alfred Iing Yoong
Keywords: DRNTU::Engineering::Materials::Metallic materials
Issue Date: 2012
Source: Made, R. I., Phua, E. J. R., Sharif, A., Pramana, S. S., Wong, C. C., Chen, Z., et al. (2012). Study of Metal Additives to Alumina Ceramics Substrate for High Temperature and Pressure Application. Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, pp.48-51.
Abstract: In this work, we present systematical characterizations of iron doped alumina substrates produced by solid state sintering of ball milled powders. It was found that the doped samples have higher fracture toughness, lower thermal conductivity, smaller coefficient of thermal expansion and higher relative dielectric constant than undoped ones. A reduction in thermal conductivity could arguably give extra protection to the package chip in a high temperature application environment and can be attributed to an increase in phonon scattering. Furthermore, the decrease in coefficient of thermal expansion also helps to reduce thermal induced stress between the substrates and device chip. The observed improvement in fracture toughness cannot be explained by the common toughening mechanism, such as crack bridging or due to the increase in crystallite size, and is the subject of further investigation.
DOI: 10.1109/EPTC.2012.6507049
Rights: © 2012 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: [ ].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MSE Conference Papers

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