Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/97062
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dc.contributor.authorMade, Riko I.en
dc.contributor.authorPhua, Eric Jian Rongen
dc.contributor.authorSharif, Ahmeden
dc.contributor.authorPramana, Stevin Snelliusen
dc.contributor.authorWong, Chee Cheongen
dc.contributor.authorChen, Zhongen
dc.contributor.authorNachiappan, Vivek Chidambaramen
dc.contributor.authorHo, Beng Yeungen
dc.contributor.authorGao, Shanen
dc.contributor.authorTok, Alfred Iing Yoongen
dc.date.accessioned2013-05-28T06:32:26Zen
dc.date.accessioned2019-12-06T19:38:31Z-
dc.date.available2013-05-28T06:32:26Zen
dc.date.available2019-12-06T19:38:31Z-
dc.date.copyright2012en
dc.date.issued2012en
dc.identifier.citationMade, R. I., Phua, E. J. R., Sharif, A., Pramana, S. S., Wong, C. C., Chen, Z., et al. (2012). Study of Metal Additives to Alumina Ceramics Substrate for High Temperature and Pressure Application. Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, pp.48-51.en
dc.identifier.urihttps://hdl.handle.net/10356/97062-
dc.description.abstractIn this work, we present systematical characterizations of iron doped alumina substrates produced by solid state sintering of ball milled powders. It was found that the doped samples have higher fracture toughness, lower thermal conductivity, smaller coefficient of thermal expansion and higher relative dielectric constant than undoped ones. A reduction in thermal conductivity could arguably give extra protection to the package chip in a high temperature application environment and can be attributed to an increase in phonon scattering. Furthermore, the decrease in coefficient of thermal expansion also helps to reduce thermal induced stress between the substrates and device chip. The observed improvement in fracture toughness cannot be explained by the common toughening mechanism, such as crack bridging or due to the increase in crystallite size, and is the subject of further investigation.en
dc.language.isoenen
dc.rights© 2012 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: [http://dx.doi.org/10.1109/EPTC.2012.6507049 ].en
dc.subjectDRNTU::Engineering::Materials::Metallic materialsen
dc.titleStudy of metal additives to alumina ceramics substrate for high temperature and pressure applicationen
dc.typeConference Paperen
dc.contributor.schoolSchool of Materials Science & Engineeringen
dc.contributor.conferenceElectronics Packaging Technology Conference (14th : 2012 : Singapore)en
dc.identifier.doi10.1109/EPTC.2012.6507049en
dc.description.versionAccepted versionen
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