Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/97078
Title: Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows
Authors: Mona, M.
Chen, Zhong
Kumar, Aditya
Issue Date: 2006
Source: Chen, Z., Kumar, A., & Mona, M. (2006). Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows. Journal of Electronic Materials, 35(12), 2126-2134.
Series/Report no.: Journal of electronic materials
Abstract: Electroless Ni-P layers with three different P contents (6.1 wt.%, 8.8 wt.%, and 12.3wt.%) were deposited on copper (Cu) substrates. Multilayered samples of Sn-3.5Ag/Ni-P/Cu stack were prepared and subjected to multiple reflows at 250°C. A tensile test was performed to investigate the effect of P content on the solder joint strength. The low P samples exhibited the highest joint strength after multiple reflows, while the strength of medium and high P samples decreased more rapidly. From interfacial analysis, the Ni3Sn4 intermetallic compound (IMC) formed at the interface of low P sample was found to be more stable, while the one of medium and high P samples spalled into the molten solder. The IMC spallation sped up the consumption of electroless Ni-P, leading to the large formation of Cu-Sn IMCs. Fractographic and microstructural analyses showed that the degradation in solder joint strength was due to the formation of layers of voids and growth of Cu-Sn IMCs between the solder and the Cu substrate.
URI: https://hdl.handle.net/10356/97078
http://hdl.handle.net/10220/10457
ISSN: 0361-5235
DOI: 10.1007/s11664-006-0322-7
Rights: © 2006 TMS.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:MSE Journal Articles

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