Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/97328
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dc.contributor.authorGao, Binen
dc.contributor.authorYu, Hongyuen
dc.contributor.authorKang, J. F.en
dc.contributor.authorChen, B.en
dc.contributor.authorLiu, L. F.en
dc.contributor.authorLiu, X. Y.en
dc.contributor.authorWang, Z. R.en
dc.contributor.authorYu, B.en
dc.date.accessioned2013-07-18T03:09:10Zen
dc.date.accessioned2019-12-06T19:41:31Z-
dc.date.available2013-07-18T03:09:10Zen
dc.date.available2019-12-06T19:41:31Z-
dc.date.copyright2012en
dc.date.issued2012en
dc.identifier.citationKang, J. F., Gao, B., Chen, B., Liu, L. F., Liu, X. Y., Yu, H., et al. (2012). Oxide-Based RRAM: A Novel Defect-Engineering-Based Implementation for Multilevel Data Storage. 2012 4th IEEE International Memory Workshop.en
dc.identifier.urihttps://hdl.handle.net/10356/97328-
dc.description.abstractA novel strategy based on defect engineering is proposed for high-performance multilevel data storage in oxide-based resistive random access memory (RRAM). Key innovations are (i) material-oriented cell engineering for desired modification of physical locations of generated oxygen vacancies in resistive switching layer and (ii) innovative operation scheme to control the distribution of oxygen vacancy conducting filaments during the switching. Excellent memory performance with four-level data storage is successfully demonstrated in hafnium-oxide-based RRAM devices, indicating the viability of the proposed engineering design strategy.en
dc.language.isoenen
dc.rights© 2012 IEEE.en
dc.subjectDRNTU::Engineering::Electrical and electronic engineeringen
dc.titleOxide-based RRAM : a novel defect-engineering-based implementation for multilevel data storageen
dc.typeConference Paperen
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen
dc.contributor.conferenceIEEE International Memory Workshop (4th : 2012 : Milan, Italy)en
dc.identifier.doi10.1109/IMW.2012.6213664en
item.grantfulltextnone-
item.fulltextNo Fulltext-
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