Please use this identifier to cite or link to this item:
|Title:||Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes||Authors:||Nai, S. M. L.
Xu, L. Y.
Tan, Cher Ming
|Keywords:||DRNTU::Engineering::Electrical and electronic engineering||Issue Date:||2012||Source:||Han, Y., Jing, H., Nai, S. M. L., Xu, L. Y., Tan, C. M., & Wei, J. (2012). Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes. Journal of materials science : materials in electronics, 23(5), 1108-1115.||Series/Report no.:||Journal of materials science : materials in electronics||Abstract:||In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 to 100 mN increased the percentage reduction in creep strain rate from 4 to 28%, for the composite compared to SnAgCu solder after 300 s of holding.||URI:||https://hdl.handle.net/10356/97817
|DOI:||10.1007/s10854-011-0557-9||Fulltext Permission:||none||Fulltext Availability:||No Fulltext|
|Appears in Collections:||SIMTech Journal Articles|
Updated on Jan 16, 2021
Updated on Jan 21, 2021
Page view(s) 50415
Updated on Jan 22, 2021
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.