Please use this identifier to cite or link to this item:
Title: Effect of IC layout on the reliability of CMOS amplifiers
Authors: He, Feifei
Tan, Cher Ming
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2011
Series/Report no.: Microelectronics reliability
Abstract: With shrinking device size and increasing circuit complexity, interconnect reliability has become the main factor that affects the integrated circuit (IC) reliability. Electromigration (EM) is the major failure mechanism for interconnect reliability. However, little research had been done on the effect of IC layout on the void nucleation time (i.e. the time where the vacancies in the metal gather and nucleate into a tiny void) in the interconnections of the circuits due to electromigration using 3D modeling. In this paper, we construct the 3D models for a CMOS class-AB amplifier and a RF low noise amplifier (LNA), and investigate the impact of layout design on the void nucleation time through the computation of the atomic flux divergence (AFD) of the 3D circuit models. From the simulation results we find that, there is a change in the value of the maximum total AFD with the change in the number of contacts or the inter-transistor distance. A change in the location of the maximum total AFD is observed in the LNA circuit with different finger number as a result of the change in the line width and the transistor rotation. This indicates a different reliability lifetime and void formation location with different layout designs.
DOI: 10.1016/j.microrel.2011.11.010
Rights: © 2011 Elsevier Ltd.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Journal Articles

Citations 50

Updated on Jan 22, 2023

Web of ScienceTM
Citations 50

Updated on Jan 25, 2023

Page view(s) 50

Updated on Jan 29, 2023

Google ScholarTM




Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.