Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/98763
Title: Carbon based multi-functional materials towards 3D system integration : application to thermal and interconnect management
Authors: Chow, W. L.
Samani, M. K.
Yap, Chin Chong
Tan, Dunlin
Shakerzadeh, Maziar
Brun, Christophe
Teo, Edwin Hang Tong
Baillargeat, Dominique
Tay, Beng Kang
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2012
Abstract: In order to meet the demands of increasing package density and miniaturization of devices without compromising performance, the most challenging issues to tackle are thermal and interconnect management. In this paper, we will first understand the interfacial transport between Si and Carbon for better system integration and discuss how novel carbon films can be used for thermal extraction. Second, we will show how carbon nanotubes can be used as interconnects using a flip chip approach as well as potential radio frequency applications.
URI: https://hdl.handle.net/10356/98763
http://hdl.handle.net/10220/13451
DOI: 10.1109/MWSYM.2012.6259415
Rights: © 2012 IEEE
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Conference Papers

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