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Title: Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realization
Authors: Tan, Chuan Seng
Lim, Dau Fatt
Peng, Lan
Li, Hong Yu
Issue Date: 2012
Abstract: Email Print Request Permissions In this invited paper, a non-UHV and non-corrosive method using self-assembled monolayer (SAM) to passivate Cu surface to prevent oxidation and contamination is investigated. The final goal is to enable low temperature Cu-Cu bonding for high density 3D IC realization.
DOI: 10.1109/LTB-3D.2012.6238046
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Conference Papers

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