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Title: Distributed thermal-aware task scheduling for 3D network-on-chip
Authors: Cui, Yingnan
Zhang, Wei
Yu, Hao
Issue Date: 2012
Source: Cui, Y., Zhang, W., & Yu, H. (2012). Distributed thermal-aware task scheduling for 3D network-on-chip. 2012 IEEE 30th International Conference on Computer Design (ICCD 2012), 494-495.
Abstract: The development of 3D integration technology significantly improves the bandwidth of network-on-chip (NoC) system. However, the 3D technology-enabled high integration density also brings severe concerns of temperature increase, which may impair system reliability and degrade the performance. Task scheduling has been regarded as one effective approach in eliminating thermal hotspot without introducing hardware overhead. However, centralized thermal-aware task scheduling algorithms for 3D-NoC have been limited for incurring high computational complexity as the system scale increase. In this paper, we propose a distributed agent-based thermal-aware task scheduling algorithm for 3D-NoC which shows high scheduling efficiency and high scalability. Experimental results have shown that when compared to the centralized algorithms, our algorithm can achieve up to 13 °C reduction in peak temperature of the system without sacrificing performance.
DOI: 10.1109/ICCD.2012.6378690
Rights: © 2012 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: [].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Conference Papers
SCSE Conference Papers

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