Now showing items 1-4 of 4
Laser focus depth adaptation for decapsulation of copper wirebonded devices
Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a ...
Customized glass sealant for ceramic substrates for high temperature electronic application
This study investigates the ceramic to ceramic bonding, using composite glass frit as the binding layer that is able to tolerate a high temperature environment for ruggedized microelectronic applications. Shear strength ...
Au-In-based hermetic sealing for MEMS packaging for down-hole application
Hermetic sealing of micro-electro mechanical systems (MEMS) sensors for down-hole application requires high-quality void-free bonds, with metallic hermetic sealing being widely used for this purpose. As most of the MEMS ...
Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters
Copper (Cu) wire bonding has become a mainstream IC assembly solution due to its significant cost savings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to ...