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Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction
(2004)
Ni and its alloys possess a lower reaction rate with Sn than Cu and Cu alloys. Ni-based under bump metallization (UBM) therefore receives considerable attention from the microelectronic packaging industry for the popular ...
Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints
(2005)
This work presents an investigation on the influence of the solder/under bump metallization (UBM) interfacial reaction to the tensile strength and fracture behavior of Sn-3.5Ag/Ni-P solder joints under different thermal ...
Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization
(2004)
Thermal aging is one of the accelerated tests for IC package reliability during manufacturing processes and under actual usage conditions. During the process of thermal aging, intermetallic compounds (IMC) grow continuously ...
Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films
(2006)
Intermetallic compounds (IMCs) are present in microelectronic solder interconnects as a result of interfacial reaction between the solder and the metallization materials. Their mechanical properties are of great interest ...
Interfacial reaction between Sn-rich solders and Ni-based metallization
(2004)
Solid state reaction between Sn-rich solders (Sn–3.5Ag and Sn–37Pb) and two types of Ni-based metallization (electroless Ni–P and sputtered Ni) has been studied. The growth rates of the main intermetallic compound (IMC), ...
Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder
(2004)
Effect of electromigration on interfacial reactions between electroless Ni–P (EL-Ni) and eutectic Sn–3.5% Ag solder has been investigated. Sandwich-type reaction couples, Cu/EL-Ni/Sn–3.5% Ag/EL-Ni/Cu, having two EL-Ni/Sn–3.5% ...
Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization
(2004)
Cooling rate is an important parameter in solder reflow process because it influences not only microstructure of solder alloy but also the morphology and growth of intermetallic compounds (IMC) formed between solder and ...
Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder
(2004)
Electroless Ni–P with a thin layer of immersion gold has been considered as a promising under bump metallization (UBM) for low-cost flip–chip technology. However, the presence of P in electroless Ni–P causes complicated ...
Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization
(2004)
This work summarizes the interfacial reaction between lead-free solder Sn-3.5Ag and electrolessly plated Ni-P metallization in terms of morphology and growth kinetics of the intermetallic compounds (IMC). Comparison with ...