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Fracture toughness measurement of thin films on compliant substrate using controlled buckling test
Thin films and multilayered structures are increasingly used in the industry. One of the important mechanical properties of these thin layers is the fracture toughness, which may be quite different from the known value of ...
Analytical modeling of reservoir effect on electromigration in Cu interconnects
Electromigration (EM) in Cu dual-damascene interconnects with extensions (also described as overhangs or reservoirs) ranging from 0 to 120 nm in the upper metal (M2) was investigated by an analytical model considering the ...