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Characterizing the interfacial fracture toughness for microelectronic packaging
In a microelectronic package there are many interfaces where the adhesion between different materials plays an important role in its reliability issue. Take an example in a flipchip package: delamination at the interfaces ...
The blister test : transition from plate to membrane behaviour for an elastic material
The crack extension force has been calculated for the blister test when the blister is in transition from plate-like to membrane behaviour. Simple equations are given for the crack extension force that are accurate to ...
The essential work of fracture and JR curves for the double cantilever beam specimen : an examination of elastoplastic crack propagation
The propagation of a crack in a double-cantilever beam (DCB) geometry where there is extensive remote plastic flow both preceding and accompanying fracture is analysed. Experiments show that there is an appreciable path ...