Now showing items 1-6 of 6
Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction
Ni and its alloys possess a lower reaction rate with Sn than Cu and Cu alloys. Ni-based under bump metallization (UBM) therefore receives considerable attention from the microelectronic packaging industry for the popular ...
Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization
Thermal aging is one of the accelerated tests for IC package reliability during manufacturing processes and under actual usage conditions. During the process of thermal aging, intermetallic compounds (IMC) grow continuously ...
Interfacial reaction between Sn-rich solders and Ni-based metallization
Solid state reaction between Sn-rich solders (Sn–3.5Ag and Sn–37Pb) and two types of Ni-based metallization (electroless Ni–P and sputtered Ni) has been studied. The growth rates of the main intermetallic compound (IMC), ...
Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder
Effect of electromigration on interfacial reactions between electroless Ni–P (EL-Ni) and eutectic Sn–3.5% Ag solder has been investigated. Sandwich-type reaction couples, Cu/EL-Ni/Sn–3.5% Ag/EL-Ni/Cu, having two EL-Ni/Sn–3.5% ...
Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization
Cooling rate is an important parameter in solder reflow process because it influences not only microstructure of solder alloy but also the morphology and growth of intermetallic compounds (IMC) formed between solder and ...
Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder
Electroless Ni–P with a thin layer of immersion gold has been considered as a promising under bump metallization (UBM) for low-cost flip–chip technology. However, the presence of P in electroless Ni–P causes complicated ...