Now showing items 31-40 of 2836
A new unified model for channel thermal noise of deep sub-micron RFCMOS
A new unified model for circuit simulation is presented to predict the high frequency channel thermal noise of deep sub-micron MOSFETs in strong inversion region. Based on the new channel thermal noise model, the simulated ...
Choice of generation volume models for electron beam induced current computation.
The spatial distribution of the electron-hole pairs generated by the electron beam is commonly called the generation volume or interaction volume. The generation volume affects the electron beam-induced current (EBIC) ...
World Englishes today
(Blackwell Publishing, 2006)
Abstract not available.
Introduction : interdisciplinary perspectives on English in China
Introduction: Interdisciplinary perspectives on English in China
Investigation of bed shear stresses subject to external turbulence
The fluctuating bed shear stress has largely been investigated only for uniform channel flows and boundary layers. In practical engineering, the flow conditions are often modified due to the presence of various ...
Impact response of reinforced concrete beam and its analytical evaluation
This paper examines the impact responses of reinforced concrete RC beams through an experimental study and presents an analytical model developed to predict the maximum midspan deflection and maximum impact load, ...
Comparisons of sidewall correction of bed shear stress in open-channel flows
When investigating sediment transport in laboratory open-channel flows, it is often necessary to remove sidewall effects for computing effective bed shear stress. Previous sidewall correction methods are subject to some ...
Loss-aversion and household portfolio choice
In this paper we empirically test if loss-aversion affects household participation in equity markets, household allocations to equity, and household allocations between mutual funds and individual stocks. Using household ...
Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization
Cooling rate is an important parameter in solder reflow process because it influences not only microstructure of solder alloy but also the morphology and growth of intermetallic compounds (IMC) formed between solder and ...
Crystal chemistry of mimetite, Pb10(AsO4)6Cl1.48O0.26, and finnemanite, Pb10(AsO3)6Cl2
The crystal chemistries of synthetic mimetite, Pb10(As5+O4)6(Cl2-xOx/2), a neutral apatite, and finnemanite, Pb10(As3+O3)6Cl2, a reduced apatite, were characterized using a combination of X-ray powder diffraction, neutron ...