Now showing items 81-83 of 83
Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation
The voids formed in the Ni3P layer during reaction between Sn-based solders and electroless Ni–P metallization is an important cause of rapid degradation of solder joint reliability. In this study, to suppress formation ...
Uniformly dispersed and controllable ligand-free silver-nanoparticle-decorated TiO2 nanotube arrays with enhanced photoelectrochemical behaviors
Homogeneously dispersed silver nanoparticles (AgNPs) were successfully decorated onto the surface of TiO2 nanotube arrays (TNTA) by means of an in situ photoreduction method. TNTA films as supports exhibit excellent ...
Reducing aggregation caused quenching effect through co-assembly of PAH chromophores and molecular barriers
The features of well-conjugated and planar aromatic structures make π-conjugated luminescent materials suffer from aggregation caused quenching (ACQ) effect when used in solid or aggregated states, which greatly impedes ...